ALINX Joins the SGET oHFM Standard Working Group, Driving Open and Modular FPGA Platforms
About the Working Group
In 2026, ALINX officially joined the oHFM (Open Harmonized FPGA Module) standard working group under SGET (Standardization Group for Embedded Technologies). The working group now includes dozens of leading hardware vendors, equipment manufacturers and research institutions worldwide, jointly developing an open, neutral FPGA modular hardware standard.
The Industry Value of the oHFM Standard
For a long time, the FPGA hardware industry has remained highly customized: core board interfaces, mechanical dimensions and software stacks from different vendors are completely incompatible, and every customer must start hardware design from scratch, leading to long development cycles, high costs and poor design reusability. This "one design per product" model has significantly raised the entry barrier for FPGA adoption, making FPGAs difficult to afford for small-batch, multi-category industry customers.
The oHFM standard fundamentally changes this through three unifications:
- Unified hardware form factor: defining core module mechanical dimensions, mounting holes, high-speed interfaces and general-purpose I/O pin definitions
- Unified software abstraction layer: defining standardized low-level hardware drivers and application programming interfaces for "develop once, run across all platforms"
- Unified compatibility certification: establishing a third-party testing and certification system to ensure true plug-and-play across vendor modules
The goal of oHFM is to turn FPGAs from "complex hardware requiring dedicated teams to customize" into "standard off-the-shelf products", just like today's computer memory modules — users select and purchase directly based on requirements and plug them in for immediate use, dramatically lowering the barrier to FPGA adoption.
ALINX's Contribution
As a core member of the working group, ALINX will contribute over a decade of FPGA core board development experience, participate in defining core electrical specifications, thermal design specifications and the software adaptation layer, and launch a full series of oHFM-standard reference design products, providing industry-ready standardized module solutions for direct mass production.